Surface Mount Rework

FINETECH's COMISS (Controlled MIx Soldering System) offers:

• extremely short soldering times
• rapid cooling resulting in small grained solder joints
• optimum conditions for BGA processing

Temperatures and heating and cooling rates can be specified and are controlled very accurately by mixing cold and hot gases and now the quantity of heat is also controlled and documented. For single component soldering and surface mount rework of fine pitch and BGA devices, real-time display of set and actual temperature profiles, including external thermocouples is provided.

Automatic Placement and Rework

Repetitive rework tasks can now be carried out without having to rely on the consistent attention of operators. FINETECH’s Fineplacer © range has been enlarged by the addition of automatic versions. A combination of the high accuracy alignment and precisely controlled rework gas temperatures with a newly developed x,y & z table and software, including automatic pattern recognition results in Placement accuracies of better than µm and suits surface mount components including Flip Chips, CSPs, µBGAs, BGAs, QFPs and PLCCs.

The modular nature of the Fineplacer System allows different tasks to be carried out, such as placement only, removal and replacement of components, site dressing, dispensing and fluxing.

Placement

The patented Vision Alignment System of the FINEPLACER system is based on the simultaneous representation of the component contacts and the substrate pads through the stationary beam splitter. Accuracies to 1 µm can be achieved for flip chip placement, LEDs and chip bonding. The largest PCB size that can be accommodated is 500 x 750mm. The standard optical equipment is a colour microscope camera.

<-- Please see the PDF download link on the left for more information.