Surface Mount Dummy Components

Quad Flat Pack component (QFP), Ball Grid Arrays (BGA) and Small Outline ICs (SOIC) are the main types of dummy devices we hold in stock, although we can draw from further extensive stocks and special manufacturing facilities. These devices are useful for machine and process trials while at the same time saving time and money.

Solder Training Kits

A number of solder training kits providing organized sets of materials including Printed Circuit Boards and components for surface mount, BGA, mixed technology or through hole solder practice are available. No need to spend time designing your own PCB and trying to get identical sets of materials for a number of candidates.

Gerber files can be supplied with kits. Lead-free and leaded material is available.

<-- Please see the PDF download link on the left for more information.